Wafer Cleaning

Plasma Solution for WLP, MEMS, TFH, Image Sensors, & PV

Plasma cleaning has traditionally been applied to remove contamination generated during a process in the device fabrication at the wafer level, or generated during an upstream assembly process. In either case, cleaning the product to remove contamination such a fluorine, oxides or metals significantly enhances the yield, reliability and performance of the integrated circuit.


Solutions for WLP, MEMS, TFH, Image Sensors, & PV
Wafer Cleaning | Descum | Stripping and Etch | Wafer Pre-Treatment |
BCM & UBM Adhesion | Dielectric Patterning | Via Cleaning | Bump Adhesion

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