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Via Cleaning

Plasma Solution for WLP, MEMS, TFH, Image Sensors, & PV

Small vias, formed in the wafer for stacked die applications, often have residue remaining as a result of the via-formation process. Optimized plasma configurations can effectively treat the vias without damaging the wafer surface.

Solutions for WLP, MEMS, TFH, Image Sensors, & PV
Wafer Cleaning | Descum | Stripping and Etch | Wafer Pre-Treatment |
BCM & UBM Adhesion | Dielectric Patterning | Via Cleaning | Bump Adhesion

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