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Stripping and Etch

Plasma Solution for WLP, MEMS, TFH, Image Sensors, & PV

Dry plasma processing is an efficient method for bulk stripping and etching of materials including photoresist, oxides, nitrides, and dielectrics. Etch rates in excess of one micron per minute with uniformities greater than 95% can be achieved. Stripping and etching processes are applied in wafer level packaging, MEMS manufacture, and disk drive processing.

Solutions for WLP, MEMS, TFH, Image Sensors, & PV
Wafer Cleaning | Descum | Stripping and Etch | Wafer Pre-Treatment |
BCM & UBM Adhesion | Dielectric Patterning | Via Cleaning | Bump Adhesion

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