As the market for “green” sources of energy grows, manufacturers of solar cells and photovoltaic devices around the world are rapidly increasing production in order to capitalize on this emerging trend. As with other semiconductor-based devices, plasma processing is used for both device manufacturing and device packaging applications.
Typical applications include wafer edge etching, wafer cleaning; metal oxide removal; organic and inorganic contamination removal; etching of thin film layers such as silicon nitride, silicon oxide, benzocylcobutene (BCB), polymers and polyimide; photoresist (PR) etching, ashing and descum; wafer surface roughening to improve bondability; wafer surface activation to increase wettability, and improve the uniformity of liquid flow over the surface of the wafer.
Nordson MARCH’s plasma systems for solar cell and photovoltaic (PV) device manufacturing and packaging are designed to provide highly repeatable results with excellent etch rates and uniformity (both within wafer and wafer-to-wafer). Our systems are also capable of handling multiple wafer sizes (including 4, 6, 8 and 12 inch wafers, as well as square and other non-round substrates), and are capable of high-throughput automated processing.
Options include SECS/GEM factory automation software. Our advanced plasma systems are highly configurable in order to meet your demanding production requirements.
Solutions for WLP, MEMS, TFH, Image Sensors, & PV
Wafer Cleaning |
Descum | Stripping and Etch | Wafer Pre-Treatment |
BCM & UBM Adhesion |
Dielectric Patterning | Via Cleaning | Bump Adhesion