Wafer Pre-Treatment (Redistribution)

Contaminants - such as oxides, organics, and fluorides - are a growing concern as geometries decrease and the ratio between the contaminant and feature increases. The larger ratio results in reduced yield and reliability of the packaged product. Plasma processing removes contamination and oxidation for increased reliability and bonding yields. Plasma also micro-roughens the wafer passivation layer for improved adhesion between the wafer passivation layer and BCB.