MEMS devices such as accelerometers, roll-over sensors and air bag deployment sensors require advanced plasma treatments during their manufacture in order to improve the device yield and long-term reliability.
Typical plasma applications for the manufacture of these advanced devices includes device cleaning, photoresist descum, stripping of materials like photoresist and benzocylcobutene (BCB), etching redistribution lines, and removing contamination.
Other applications include surface cleaning and roughening; chemical bond activation to improve bondability; and increasing wettability and uniformity of liquid flow over the wafer surface.
Solutions for WLP, MEMS, TFH, Image Sensors, & PV
Wafer Cleaning |
Descum | Stripping and Etch | Wafer Pre-Treatment |
BCM & UBM Adhesion |
Dielectric Patterning | Via Cleaning | Bump Adhesion