Dielectric Patterning

Plasma Solution for WLP, MEMS, TFH, Image Sensors, & PV

Typical methods of forming the redistribution layer include patterning the dielectric redistribution material using typical photolithography methods. Plasma is a viable alternative for dielectric patterning where typical wet processing methods can be avoided.


Solutions for WLP, MEMS, TFH, Image Sensors, & PV
Wafer Cleaning | Descum | Stripping and Etch | Wafer Pre-Treatment |
BCM & UBM Adhesion | Dielectric Patterning | Via Cleaning | Bump Adhesion

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