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Die Attach

Plasma Solution for Advanced Semiconductor Packaging & Assembly

Plasma cleaning of substrates will improve the adhesion of the die attach epoxy via surface activation and provide an improved bond between the die and the substrate. Better bonds improve heat dissipation. In addition, plasma processing efficiently removes oxidation from the metal surface to ensure void-free die attachment. Oxidation can adversely affect die attachment when eutectic solder is used as an adhesive material for die bonding.

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Die Attach | Wire Bonding | Underfill | Encapsulation & Mold

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