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Bump Adhesion

Plasma Solution for WLP, MEMS, TFH, Image Sensors, & PV

Plasma cleaning of the wafer surface improves bump adhesion and has been demonstrated to increase bump shear strength dramatically. Bump materials include solder of varying compositions and gold studs.

Solutions for WLP, MEMS, TFH, Image Sensors, & PV
Wafer Cleaning | Descum | Stripping and Etch | Wafer Pre-Treatment |
BCM & UBM Adhesion | Dielectric Patterning | Via Cleaning | Bump Adhesion

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