BCB and UBM Adhesion

Plasma Solution for WLP, MEMS, TFH, Image Sensors, & PV

Polymers, such as benzocyclobutene (BCB), are dispensed on the wafer and act as a dielectric for the redistribution layer. Plasma alters the topography and wettability of the wafer’s original passivation layer to promote adhesion. Plasma promotes under bump metallization (UBM) in the same manner.


Solutions for WLP, MEMS, TFH, Image Sensors, & PV
Wafer Cleaning | Descum | Stripping and Etch | Wafer Pre-Treatment |
BCM & UBM Adhesion | Dielectric Patterning | Via Cleaning | Bump Adhesion

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