Typical applications include wafer edge etching, wafer cleaning; metal oxide removal; organic and inorganic contamination removal; etching of thin film layers such as silicon nitride, silicon oxide, benzocylcobutene (BCB), polymers and polyimide; photoresist (PR) etching, ashing and descum; wafer surface roughening to improve bondability; wafer surface activation to increase wettability, and improve the uniformity of liquid flow over the surface of the wafer.
Nordson MARCH’s plasma systems for solar cell and photovoltaic (PV) device manufacturing and packaging are designed to provide highly repeatable results with excellent etch rates and uniformity (both within wafer and wafer-to-wafer). Our systems are also capable of handling multiple wafer sizes (including 4, 6, 8 and 12 inch wafers, as well as square and other non-round substrates), and are capable of high-throughput automated processing.