In PCB manufacturing, plasma technology can deliver higher uniformity and reproducibility than chemical or mechanical processes. It is efficient, economical and environmentally benign. Plasma processing increases the surface energy of advanced materials, including fluoropolymer, providing excellent lamination and wettability for plating through-holes without the use of wet chemicals. It also allows metalization to the inner layers by removing resin smear created in the drilling process and removes carbon byproducts from blind vias.