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Printed Circuit Board image

Non-Stick Surface Activation

The Nordson MARCH plasma process can modify fluoropolymer surfaces and desmear resins to prepare hole walls for electro-less copper or direct metalization.

Surface activation for double-sided and multi-layer fluoropolymer through-hole boards is necessary to increase surface wettability. Chemical processes do not have the flexibility to treat non-stick materials and other resins mixed in the same panel. However, a single plasma process can modify fluoropolymer surfaces and desmear resins, effectively preparing hole walls for electro-less copper or direct metalization.

The figures below display an untreated non-stick panel on the left where a water droplet beads on the hydrophobic surface. The figure on the right shows the effect of plasma by improving the wettability of the non-stick surface.

Img 1(non-stick panel before plasma treatment): Img 2(non-stick panel after plasma treatment

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