Printed Circuit Board image

Non-Stick Surface Activation

The Nordson MARCH plasma process can modify fluoropolymer surfaces and desmear resins to prepare hole walls for electro-less copper or direct metalization.

Surface activation for double-sided and multi-layer fluoropolymer through-hole boards is necessary to increase surface wettability. Chemical processes do not have the flexibility to treat non-stick materials and other resins mixed in the same panel. However, a single plasma process can modify fluoropolymer surfaces and desmear resins, effectively preparing hole walls for electro-less copper or direct metalization.

The figures below display an untreated non-stick panel on the left where a water droplet beads on the hydrophobic surface. The figure on the right shows the effect of plasma by improving the wettability of the non-stick surface.

Img 1(non-stick panel before plasma treatment): Img 2(non-stick panel after plasma treatment

Related Products

PCB-800 Plasma Treatment SystemPCB-800 Plasma Treatment System

The completely redesigned PCB-800 plasma system maintains a perfect balance between its predecessor and its successor, the ProVIA™ plasma system. The chamber is still purely PCB Series inspired, but everything else has adopted VIA™ Series technology.

PCB-1600 Plasma Treatment SystemPCB-1600 Plasma Treatment System

The completely redesigned PCB-1600 plasma system maintains a perfect balance between its predecessor and its successor, the ProVIA™ plasma system. The chamber is still purely PCB Series inspired, but everything else has adopted VIA™ Series technology.

PCB-400 Plasma Treatment SystemPCB-400 Plasma Treatment System

Unlike the previous model, this updated version of the PCB-400 utilizes many of the VIA™ Series’ technologies. Most noticeable is the user interface, which is the .NET Via Series control system. Less obvious are the same MFCs, PLCs and controllers.

ProVIA Plasma Treatment SystemProVIA Plasma Treatment System

The ProVIA™ System is specifically configured to meet the demands of today’s high throughput PCB manufacturing operations where uniformity is key in desmear and etch back applications for HDI, flexible and rigid circuit board manufacturing technologies.

MaxVIA Plasma Treatment SystemMaxVIA Plasma Treatment System

The MaxVIA™ System is specifically configured to meet the demands of high throughput PCB manufacturing where uniformity is a key operation in desmear and etch back applications for HDI, flexible and rigid circuit board manufacturing technologies.

RollVIA Plasma Treatment SystemRollVIA Plasma Treatment System

Nordson MARCH's RollVIA is a completely self-contained vacuum plasma system with integrated roll-to-roll material handling for production PCB manufacturing environments.

FlexVIA Plasma Treatment SystemFlexVIA Plasma Treatment System

The FlexVIA™ System from Nordson MARCH is a self-contained vacuum plasma system specifically designed for maximum efficiency and cost effective treatment of flexible materials with a space-saving, compact chassis and two easy-access, front-loading doors.

FlexVIA-Plus Plasma Treatment SystemFlexVIA-Plus Plasma Treatment System

Specifically designed for the processing of flexible PCB substrates, the FlexVIA-Plus™ Plasma System from Nordson MARCH further extends the VIA™ technology platform into the field of flexible material application.

MaxVIA-Plus Plasma Treatment SystemMaxVIA-Plus Plasma Treatment System

The MaxVIA-Plus™ System increases process capacity, while minimizing consumption of valuable production floor space. Similarly, the system provides uniform plasma to meet the rigorous requirements of the PCB manufacturing environment.

Social Media

Like us on Facebook
Follow us on LinkedIn
Watch us on YouTube