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Inner Layer Preparation

Plasma alters the topography and wettabilitty of inner printed circuit board layers to promote adhesion.

Cover-coated inner board layers that contain flex materials with unsupported polyimides have smooth surfaces that are difficult to laminate. Plasma alters the topography and wettability of the inner layers to promote adhesion by allowing thin layer processing through use of flex clips. Other chemical processes are not as effective: it is difficult to control the amount of material removed, and unsupported polyimides are inert to most chemicals.

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