Nordson MARCH Solutions by Industry


Semiconductor

Semiconductor
Nordson MARCH has a variety of plasma treatment solutions specifically designed for the unique needs of the advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP) and micro electro mechanical (MEMS) industries. Plasma applications include cleaning, wire bond improvement, descum, bump adhesion, stripping and etch.

Semiconductor

Printed Circuit Board

Printed Circuit Board
Printed circuit board manufacturers work with our PCB Business Group due to the implementation of new materials technology, and smaller geometries in HDI, flex, and rigid flex applications. Plasma technology can deliver higher uniformity and reproducibility than chemical or mechanical processes.

Printed Circuit Board

Hard Disk Drive

Hard Disk Drive
Plasma is an enabling technology for the manufacture of components used to assemble hard disk drives for data storage. Components that require the use of plasma include disk drive suspension, read/write heads, and magnetic media. Typical plasma applications for the manufacture of these advanced devices includes device cleaning, photoresist descum, stripping of materials like photoresist and polyimide, etching unique materials and removing contamination.

Hard Disk Drive

Industrial

Industrial
The utilization of plasma treatment for Industrial applications has proven to be a vital step to alter surface characteristics for enhanced paint adhesion, bonding of dissimilar plastics to metal as well as paint or epoxy residue removal.

Industrial

Life Science

Life Science
Nordson MARCH provides plasma treatment solutions that improve product performance, make more reliable devices and lower the cost to process for companies that manufacture leading edge medical devices including cardiac rhythm management products, catheters, stents, ocular devices, and filter media.

Life Science

LED

LED
High reliability and yield in the manufacturing of Light Emitting Diodes (LED) has become more important as these devices are being utilized in high value products such as automobiles, televisions, and personal computers. Plasma is utilized to increase the wire bond strength, enhance heat transfer in die attach, and eliminate silicone mold adhesion problems within these LED packages.

LED

Photovoltaic / Solar

Photovoltaic / Solar
Plasma treatment is used for solar/photovoltaic device manufacturing and device packaging in applications that include wafer edge etching, wafer cleaning; metal oxide removal; organic and inorganic contamination removal; etching of thin film layers such as silicon nitride, silicon oxide, wafer surface roughening; and wafer surface activation.

Photovoltaic / Solar