Wire Bonding for Medical Devices

To ensure high device reliability and minimize manufacturing costs, it is important to optimize the wire bonding process to ensure good bond strengths and yields. Poor bond strengths and low yields are often due to upstream contamination sources or the selection of materials in medical devices. Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.

Related Products

AP-600 & AP-300 Bench-Top Plasma Treatment Systems

State-of-the-art plasma treatment in a compact, bench-top configuration for plasma cleaning, surface activation and adhesion improvement

AP-1000 Plasma Treatment System

Nordson MARCH's AP-1000 has a PLC controller with touch screen interface that provides industrial reliability and easy use. It is designed to meet the rigorous demands of 24-hour operation in high-performance manufacturing environments.

AP-1500 Plasma Treatment System

The new AP-1500 plasma system from Nordson MARCH is an extra-large “batch”-type plasma system used to clean and treat electronic components, circuit boards, and medical & life science devices for a variety of assembly and packaging applications.

FlexTRAK Plasma Treatment System

The FlexTRAK from Nordson MARCH offers high-throughput capability. Its small chamber volume and proprietary process control enable unmatched short cycle times, while its unique slim structure minimizes floor space requirements.

PCB-400 Plasma Treatment System

PCB-400 Plasma Treatment System is designed for PCB production facilities, pilot lines, laboratories, universities, and R&D centers that require advanced plasma treatments in a compact, small-footprint design

PCB-Series Plasma Treatment Systems

The PCB-Series from Nordson MARCH is specifically configured to meet high-to-low production requirements and meets the demands of rigorous 24 hour operation

White Papers

Critical Plasma Processing Parameters for Improved Strength of Wire Bonds

Technology Drivers for Plasma Prior to Wire Bonding

Fluorine Factor in Wire Bond Reliability