Printed Circuit Board
Hard Disk Drive
Photovoltaic / Solar
Contact Technical Service
Plasma Learning Center
To ensure high device reliability and minimize manufacturing costs, it is important to optimize the wire bonding process to ensure good bond strengths and yields.
Plasma-enhanced surface preparation prior to the underfill process has proven to increase underfill wicking speed, increase fillet height and uniformity, minimize voiding, and improve underfill adhesion.
Plasma Treatment Solution - Encapsulation and Molding for Medical Device Manufacturing
Plasma Processing for Optimal Medical Device Manufacturing
Surface Preparation for Improved Adhesion
Controlled Chemical Plasma Etching
© 2014 Nordson Corporation