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Plasma Solutions for Light Emitting Diodes (LED) Devices

High reliability and yield in the manufacturing of Light Emitting Diodes (LED) has become more important as these devices are being utilized in high value products such as automobiles, televisions, and personal computers. Plasma is utilized to increase the wire bond strength, enhance heat transfer in die attach, and eliminate silicone mold adhesion problems within these LED packages.

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Wire Bonding for LED

Gas plasma technology can be used to clean LED pads prior to wire bonding to improve bond strengths and yields.

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Die Attach for LED

Plasma cleaning of substrates will improve the adhesion of the die attach epoxy via surface activation and provide an improved bond between the die and the substrate.

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Encapsulation & Molding for LED

Plasma processing greatly improves adhesion of mold compounds by increasing the substrate surface energy and results in increased package reliability.