Printed Circuit Board
Hard Disk Drive
Photovoltaic / Solar
Plasma Learning Center
The FlexTRAK is a highly configurable, high-throughput plasma system. Its universal architecture accommodates a multitude of material handling configurations to support a wide assortment of variable-size form factors.
The FlexTRAK-WF Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.
The FlexTRAK-WR Plasma System is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter
Surface Preparation for Improved Adhesion
Plasma-Enhanced Surface Modification Improves Production of Microelectronics
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