Ideally suited for the printed circuit board (PCB) plasma manufacturing requirements, Nordson MARCH’s unique approach of isolated, temperature-controlled panel processing delivers superior plasma etching process capabilities for etch-back, plasma desmear and surface activation of large flex or rigid panels of various sizes and roll-to-roll substrates. Nordson MARCH’s large panel processing equipment can be configured with kHz or MHz RF Generation and is available in chamber sizes processing multiple panels from 12” x 18” up to 24” x 42”. Custom equipment configurations are available for large and thick panel requirements.