Uniform etch-rate and best-in-class value are the key features of Nordson MARCH’s reactive ion etching tools. Micron-level removal, descum, surface roughening and traditional failure analysis can easily be accomplished with the industry-leading hardware that bring sophisticated performance to the laboratory, R&D group or Wafer Level Packaging Fab. Nordson MARCH’s RIE equipment will accommodate a range of sizes, including 75mm, 150 mm, 200 mm, 300 mm wafers or non-standard geometries. Reactive ion etch equipment is offered with manual interface or automated robotic handling options.