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Reactive Ion Etching (RIE) Series Systems

Uniform etch-rate and best-in-class value are the key features of Nordson MARCH’s reactive ion etching tools. Micron-level removal, descum, surface roughening and traditional failure analysis can easily be accomplished with the industry-leading hardware that bring sophisticated performance to the laboratory, R&D group or Wafer Level Packaging Fab. Nordson MARCH’s RIE equipment will accommodate a range of sizes, including 75mm, 150 mm, 200 mm, 300 mm wafers or non-standard geometries. Reactive ion etch equipment is offered with manual interface or automated robotic handling options.

Featured RIE Series

FlexTRAK-WR Plasma Treatment System for Semiconductor and Wafer Applications
FlexTRAK-WR Plasma System

The FlexTRAK-WR Plasma System is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter

RIE-1701 Plasma System for Semiconductor and Wafer Applications
RIE-1701 - Reactive Ion Etch Plasma System

The RIE-1701 Plasma System is designed for advanced etching applications such as: removal of interlayer films for failure analysis, de-encapsulation and dielectric material removal and etching.