RollVIA Plasma Treatment System

RollVIA Plasma Treatment System

The RollVIA™ Plasma System is a completely self-contained vacuum treatment system with integrated roll-to-roll material handling for production PCB manufacturing environments.

 

Nordson MARCH’s RollVIA™ System is specifically configured to meet the demands of today’s most advanced roll-to-roll production PCB manufacturing operations.

Plasma treatment uniformity is a key operational feature in surface activation, desmear and etchback applications for flexible circuit board manufacturing technologies.  The integrated roll-to-roll material handling system ensures precise control of roll speed, tension, and edge guidance for substrates as thin as 25 microns. Optical based edge guide detection allows for reliable control during rewind operations. Substrate loading is simple with easy access to the load and unload sections via four doors.

Unlike any existing competitive products, the RollVIA system platform is completely self-contained.  The vacuum system, plasma chamber, control electronics, and 40 kHz power supply are housed in a single enclosure. Full front and rear access allows for convenient service to all interior components. The pump is positioned on rollers for easy removal.

The RollVIA system incorporates the best of Nordson MARCH’s market leading-edge plasma technology combined with novel application specific technology development based on our greater than 25 years of experience. Through extensive research and development, the RollVIA system presents unique vacuum and gas flow technology, new electrode designs, and superior temperature management. The careful balance of these critical design elements and process recipe parameters delivers a system that creates the most uniform  treatment for key applications like desmear and landing pad cleaning.

The RollVIA system’s superior performance capabilities are complemented by very attractive low-cost-of-ownership aspects. The system features a very compact and service-friendly design. The vertical loading concept allows for equal treatment on both sides of the substrate maximizing product qualifty and throughput. The fast vacuum pump down and greatly enhanced process cycle times further add to the throughput and productivity of the system.

Features and Benefits

  • High to low volume roll-to-roll vacuum plasma
  • Available in three (3) configurations to meet a wide variety of customer production requirements
  • Proven web handling technology
  • Patented plasma systems produce superior process uniformity
  • Flexible PCB applications include surface activation, cleaning and desmear
  • Small  footprint system with integrated pump package

Related Solutions

Carbon Removal
Nordson MARCH's plasma cleaning technology removes the carbon from conventional through-hole board vias & blind vias typically used on boards where component space is restricted.

Desmear & Etch Back
Nordson MARCH's plasma treatment technology removes epoxies, polyimides, high Tg blends, mixed materials & other resins more effectively than traditional methods of etching and desmearing

Inner Layer Preparation
Plasma treatment technology from Nordson MARCH alters the topography & wettability of cover-coated inner board layers, promoting adhesion by allowing thin layer processing using flex clips

Non-Stick Surface Activation
Use plasma technology from Nordson MARCH for surface activation of double-sided and multi-layer fluoropolymer through-hole boards to increase surface wettability.

Residue Removal (Descum)
Nordson MARCH's plasma technology effectively removes resist residue from inner layers and panels as well as residual solder mask bleed for better bonding and solderability

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