FP64 systems are specifically configured to meet flex panel production requirements. Daily operating expenses, such as the process gases and power consumption, are minimized through unique design concepts. The FP64 system is a cost and space efficient plasma system for inner layer processes and flexible panel formats.
The FP64 platform is completely self-contained, requiring minimal floor space. The pump, chamber, control electronics, and 13.56 MHz power supply are housed in a single enclosure. Full front access allows for convenient access to all interior components. The pump is positioned on rollers for easy removal.
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Carbon Removal
Nordson MARCH's plasma cleaning technology removes the carbon from conventional through-hole board vias & blind vias typically used on boards where component space is restricted.
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Desmear and Etch Back
Nordson MARCH's plasma treatment technology removes epoxies, polyimides, high Tg blends, mixed materials & other resins more effectively than traditional methods of etching and desmearing
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Inner Layer Preparation
Plasma treatment technology from Nordson MARCH alters the topography & wettability of cover-coated inner board layers, promoting adhesion by allowing thin layer processing using flex clips
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Residue Removal (Descum)
Nordson MARCH's plasma technology effectively removes resist residue from inner layers and panels as well as residual solder mask bleed for better bonding and solderability
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Teflon Activation
Use plasma technology from Nordson MARCH for surface activation of double-sided and multi-layer Teflon through-hole boards to increase surface wettability.
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