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FlexTRAK Series Plasma Treatment Systems

High-volume, automated plasma processing capabilities include SMEMA inline, island, magazine-to-magazine, pick-and-place robot, wafer transfer and custom material movement. These requirements are just some of the existing interface options of the plasma treatment systems, including the Nordson MARCH XTRAK and FlexTRAK platforms. The versatile, exceptionally uniform, compact chamber design allows for interchangeable processing configurations and plasma modes, including direct, RIE and patented IFP (ion free plasma) technologies.

Featured FlexTRAK Series

FlexTRAK-CDS Plasma Treatment System
FlexTRAK-CDS Plasma Treatment System

The FlexTRAK-CDS plasma system is designed for high throughput processing of lead frame strips, laminated substrates, and other strip-type electronic components, up to 10 strips per plasma cycle.

FlexTRAK-CD Plasma Treatment System
FlexTRAK-CD Plasma Treatment System

The FlexTRAK-CD plasma system is designed for high throughput processing of lead frame strips and other strip-type electronic components, up to 5 strips per plasma cycle

FlexTRAK-2MB Plasma Treatment System for Semiconductor and Wafer Applications
FlexTRAK-2MB Plasma Treatment System

The FlexTRAK-2MB plasma system is designed for high throughput, inline processing of microelectronic devices held in boats, trays or other carriers.

FasTRAK Plasma Treatment System

The FasTRAK™ Plasma System is a fully-automated, high-throughput, plasma treatment system for lead-frame strips, laminate substrates, and other strip-type microelectronic components.

FlexTRAK Plasma Treatment System for Semiconductor and Wafer Applications
FlexTRAK Plasma Treatment System

The FlexTRAK is a highly configurable, high-throughput plasma system. Its universal architecture accommodates a multitude of material handling configurations to support a wide assortment of variable-size form factors.

FlexTRAK-WF Plasma Treatment System

The FlexTRAK-WF Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.