The FlexTRAK-CD “Compact Design” system is designed for high throughput processing of lead-frame strips, laminate substrates, and other strip-type microelectronic components, up to 10 strips per cycle. It offers these capabilities in a very small-footprint chassis that consumes a minimum of lab floorspace—meaning you have more room for more systems and greater productivity from the same floorspace area.
The patented F3-type plasma chamber design provides unmatched treatment uniformity and process repeatability. Its three-axis symmetrical chamber ensures all areas of the strip are treated uniformly, while tight control over all process parameters ensures highly repeatable results.
HIGH-THROUGHPUT PROCESSING
The FlexTRAK-CD system’s integrated strip handler provides rapid and reliable material transfer for a wide range of strip sizes, up to 10 strips per cycle. Processing can be done from most types of strip magazines. The patented F3 chamber design and control architecture enable short plasma cycle times with very low overhead, which maximizes throughput and minimizes cost of ownership (COO).