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Nordson MARCH News

News

Nordson MARCH Introduces the SPHERE Series Plasma Treatment Systems for Semiconductor Applications
(01 Jul 2015)
Nordson MARCH to be exhibiting at SEMICON West booth #5743

Nordson MARCH Offers Free Technical Consulting Services on Plasma Treatment at SMT Hybrid Packaging, Nuremberg, DAGE Deutschland Stand 6-314
(28 Apr 2015)
Plasma cleaning prior to wire bonding delivers a cleaner bonding surface, reducing device failures

Nordson MARCH Wins 2015 New Product Introduction Award for its FlexVIA-Plus Plasma Treatment System
(10 Mar 2015)
System provides desmear and etchback plasma treatment of flexible electronic substrates with capacity of up to 30 panels per cycle

Nordson MARCH Demonstrates FlexTRAK-CD Plasma System for Lead Frame and Strip-type Electronic Components at NEPCON Japan
(12 Jan 2015)
Nordson MARCH will be in East Hall 2, Booths 12-20

Nordson Advanced Technology K.K. Japan Moves to Larger, Customer-Focused Facility
(24 Nov 2014)
Supports Nordson ASYMTEK, Nordson DAGE, Nordson MARCH, Nordson YESTECH for applications in semiconductor packaging and electronics assembly

Nordson MARCH Presents Two Papers on Plasma Cleaning at the ECS/SMEQ Symposium, Cancun, Mexico, October 7, 2014 Session P4
(01 Oct 2014)
David Foote, Nordson MARCH global applications manager, will present at 10:40 AM and at 11:20 AM as part of the General Plasma Processes session in the Expo Center on the 1st floor, Universal 5.

Nordson MARCH introduces the FlexTRAK-S Plasma System with large capacity plasma chamber for advanced semiconductor and electronics packaging
(25 Aug 2014)
Integrates with a variety of process equipment in electronics manufacturing to offer flexibility and excellent plasma treatment

Nordson MARCH White Paper, Plasma Clean to Reduce Wire Bond Failures, Now Available Online
(07 Jul 2014)
Describes wire bond failures, their causes, and ways to eliminate them

Plasma treatment can improve conformal coating adhesion in electronics manufacturing
(18 Jun 2014)
Recent studies have shown that plasma treatment of printed circuit boards prior to conformal coating improves the adhesion of the coatings.

Nordson MARCH Introduces New FlexVIA-Plus™ Plasma Treatment System to Process Flexible Electronic Substrates
(28 May 2014)
Adds capability of desmear and etchback with increased capacity of up to 30 panels per cycle

Nordson MARCH Introduces New MaxVIA-Plus™ Plasma Treatment System for Electronic Circuit Board Fabrication
(17 Apr 2014)
Their Korean distributor, Worldtechnology, will demonstrate the new plasma system in their booth #E301 at the PCB manufacturers’ event, KPCA

Nordson MARCH introduces the new FlexTRAK-CDS Plasma System for high-throughput plasma treatment of strip-type electronic components
(01 Apr 2014)
The compact machine provides highly uniform plasma treatment to lead frame strips, laminated substrates and other strip-type electronic components