San Francisco, California, USA – July 7th, 2011 - Nordson MARCH, a global leader in plasma processing technology, introduces the new FlexTRAK™-WF plasma treatment system, a low-cost, cassette-based automated plasma treatment system that handles five wafer sizes with minimal hardware change-over. An integrated robot and aligner automate the processing of a wide variety of wafers and other flat substrates. The system offers high throughput, ranging up to 50 wafers per hour, while maintaining superior plasma uniformity for ashing, etching, and descum for wafer level packaging and general wafer-based processing applications.
The FlexTRAK-WF treatment system provides two separate wafer load stations for production continuity and minimal idle time. Technologies such as a universal cassette stage and multi-size aligner allow for processing of wafer sizes ranging from 3 inches to 200 mm with minimal hardware change-over, reducing user intervention and maximizing system utility. The system also utilizes integrated wafer recognition technology to detect and adjust for potential issues such as wafer protrusion, double-stacking, and cross-slotting, thereby achieving high equipment reliability.
"Plasma treatment is an enabling technology that significantly improves quality in many areas of wafer level packaging and the applications are growing steadily," explained James Getty, vice president Business Development and Applications, Nordson MARCH. “Nordson MARCH's new FlexTRAK-WF system automates the plasma treatment process by expanding the number and size of wafers that can be processed during one run, speeding throughput and reducing costs.”
Nordson MARCH will be demonstrating the advanced capabilities of the FlexTRAK-WF in booth #6071 at SEMICON West, Moscone Center, San Francisco, CA from July 12 – July 14, 2011.
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