Leading mobile phone and tablet manufacturers throughout the world use Nordson Corporation (Nasdaq: NDSN) equipment to perform a variety of critical processes in the assembly of printed circuit boards, semiconductor packages, camera modules, MEMS devices, LEDs, speakers, touch panels, keypads, displays, ear buds, and product housings.
The company will be demonstrating its latest technologies and product lines at INTERNEPCON JAPAN 2012, which will be held in Tokyo on January 18-20. Engineers and product specialists will be available at Booth 40-30 East (East Hall 5) to discuss attendees' manufacturing challenges, and demonstrate new ways to increase throughput and yields while reducing production costs.
Nordson MARCH is the global leader in advanced plasma machine technology for the semiconductor, printed circuit board, life science, hard disk drive, LED, and solar / photovoltaic industries. The AP-1000 Plasma Treatment System is designed to meet the rigorous demands of 24-hour operation in high-performance manufacturing environments. The system delivers quality plasma treatment along with unmatched reliability, safety and ease of operation and maintenance