Nordson MARCH, a global leader in plasma processing technology, will demonstrate equipment and explain how to perform a variety of critical plasma treatment applications for the assembly of semiconductor packages, wafer level packaging, light emitting diodes (LEDs) and micro-electro mechanical devices (MEMS) at three trade shows in June. Product specialists and support engineers will be available at all three shows to discuss plasma system requirements for essential applications such as descum, stripping, dielectric etching, photoresist, die attach, and wire bonding.
The shows, dates, locations, booth numbers and the Nordson MARCH premier partners are:
- Philippine Semiconductor and Electronics (PSECE)
- 06 Jun 2012 - 08 Jun 2012
- Pasay City, Manila
- Maxtronix booth #191, 192, 205, 206
- JPCA / JISSO PROTEC
- 13 Jun 2012 - 15 Jun 2012
- Tokyo, Japan
- Nordson booth #4E-01
- Nippo booth #3A-27
- LED Lighting Taiwan / Photonics Festival
- 19 Jun 2012 - 21 Jun 2012
- Taipei, Taiwan
- Nordson booth #M936