Thermal Compound

Nordson EFD's innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials.

Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and cooling cycles (so called pump-out), create voids and lose effectiveness, leading to over heating of electronic components and premature product failure.

Nordson EFD's non-silicone thermal compounds are formulated to virtually eliminate pump-out, ensuring long-lasting thermal management and effective heat transfer.

• Excellent heat transfer
• Good wetting
• Low bond line
• Low thermal resistance
• High thermal conductivity (high bulk thermal conductivity) for thick-film and gap-fill applications
• Non-silicone
• Does not dry out
• Resists spreading / pump-out
• Long, reliable performance
• Water cleanable for easy use and clean-up
• Optimal rheological properties for dispensing from syringe barrels with hand plungers, or more convenient, precise and consistent application of the thermal compound with Nordson EFD’s line of electro pneumatic dispensers
• High dielectric strength
• Long shelf-life stability
• RoHS and REACH compliant
• Lead-free

Product Stability for reliable long lasting thermal management

Company A: Standard white thermal grease
Zero thermal cycles	After 300 thermal cycles: Thermal grease pumps out and creates voids
Nordson EFD non-silicone thermal compound
Zero thermal cycles	After 300 thermal cycles: Remains tacky, good wetting, no pump out