IPC J-Standards

EFD Solder Paste Group continuously strives to exceed workmanship standards of IPC (The Institute for Interconnecting and Packaging Electronic Circuits) Guidelines for the following J-Standards to guarantee customer satisfaction.
  • J-STD-003 – Solderability Test for Printed Boards
  • J-STD-004 – General Requirements and Test Methods for Soldering Fluxes
  • J-STD-005 – General Requirements and Test Methods for Soldering Paste
  • J-STD-006 – Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
For more information on IPC, please visit www.ipc.org.

 

 

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