Nordson EFD specializes in developing solder paste formulations to meet the most stringent application requirements, including:
- Fine pitch
- Enhanced wetting
- Low residue
- Lead-free shiny fillet
- Halide-free
Nordson EFD solder paste is also ideal for:
- Difficult to solder surfaces (ex. Stainless Steel)
- Extended reflow cycle times (greater than 6 minutes)
- Gap filling and vertical surfaces
- Rapid reflow cycle times (less than 5 seconds)
- UV traceable
- Pin transfer or dipping formulations
Nordson EFD provides application-based specialized solder products, complete solder paste dispensers and develops supportive technical partnerships with our customers to deliver consistent and reliable solder joints that improve yields and reduce costs in electronics and electro-mechanical assembly processes. The Solder Paste Group is a four-time recipient of Circuits Assembly’s Service Excellence Awards for providing superior service and support in the electronic assembly industry.