| Flux Features |
| Dispensing |
NC |
RA |
RMA |
WS |
| Clear Residue |
 |
 |
 |
 |
| Difficult-to-Solder Surfaces |
 |
 |
 |
 |
| Enhanced Wetting |
 |
 |
 |
 |
| Extended Reflow Cycle Time (> 6 minutes) |
 |
 |
 |
 |
| Fine Pitch |
 |
 |
 |
 |
| Gap Filling and/or Vertical Surfaces |
 |
 |
 |
 |
| General Purpose |
 |
 |
 |
 |
| Halide-free |
 |
 |
 |
 |
| Lead-free Shiny Fillet |
 |
 |
 |
 |
| Low Residue |
 |
 |
 |
 |
| Pin Transfer or Dipping (low viscosity) |
 |
 |
 |
 |
| Rapid Reflow Cycle Time (< 5 seconds) |
 |
 |
 |
 |
| Reduced Slump |
 |
 |
 |
 |
| Restricted Residue |
 |
 |
 |
 |
| UV Traceable |
 |
 |
 |
 |
| Printing |
NC |
RA |
RMA |
WS |
|
| 24-hour |
 |
 |
 |
 |
| Clear Residue |
 |
 |
 |
 |
| Difficult-to-Solder Surfaces |
 |
 |
 |
 |
| Enhanced Wetting |
 |
 |
 |
 |
| Extended Reflow Cycle Time (>6 minutes) |
 |
 |
 |
 |
| Fine Pitch |
 |
 |
 |
 |
| General Purpose |
 |
 |
 |
 |
| Halide-free |
 |
 |
 |
 |
| Lead-free Shiny Fillet |
 |
 |
 |
 |
| Reduced Slump |
 |
 |
 |
 |
| Restricted Residue |
 |
 |
 |
 |