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Solder Formulations

Alloy
Alloy Selection
Containing Lead		 Solidus
(°C)		 Liquidus
(C°) 		Tensile Strength
(psi / MPa) 		Powder Mesh
Size
Sn43 Pb43 Bi14 144 163 6120 / 42.2 II, III
Sn62 Pb36 Ag2 179 189 6700 / 46.2 II, III, IV, V, VI
Sn63 Pb37 -E- 183 6700 / 46.2 II, III, IV, V, VI
Sn60 Pb40 183 191 6200 / 42.7 II, III, IV, V, VI
Sn10 Pb88 Ag2 268 290 4900 / 33.8 II, III, IV, V, VI
Sn5 Pb92.5 Ag2.5 287 296 4210 / 29.0 II, III, IV, V
Sn10 Pb90 302 302 4600 / 31.7 II, III, IV, V, VI
Sn5 Pb95 308 312 4190 / 28.9 II, III, IV, V
Lead-free
Alloy Selection 		Solidus
(°C)		 Liquidus
(C°) 		Tensile Strength
(psi / MPa) 		Powder Mesh
Size
Sn42 Bi58 -E- 138 8000 / 55.2 II, III
Sn96.5 Ag3.0 Cu0.5 217 219 7340 NA 50.6 II, III, IV, V, VI
Sn96.3 Ag3.7 -E- 221 8900 / 61.4 II, III, IV, V, VI
Sn100 MP 232 1800 / 12.4 II, III, IV, V
Sn95 Sb5 232 240 5900 / 40.7 II, III, IV, V, VI
Sn95 Ag5 221 245 10100 / 69.6 II, III, IV, V, VI
Sn89 Sb10.5 Cu0.5 242 262 12000 / 82.7 II, III, IV, V
–E–: Eutectic     MP: Melting Point
Alloy Powder Size
Powder Type Dispense Tip Size Size (micron) Mesh Count Dispense Dot Dia. Aperature (mm/in) GullwingLead Pitch (mm/in) Square/Circle Aperature (mm/in)
II ≥21 ga. 75-45µ -200 325 0.80/0.030 0.65/0.025 0.65/0.025
III ≥23 ga. 45-25µ -325 500 0.50/0.020 0.50/0.020 0.50/0.020
IV ≥25 ga. 38-25µ -400 500 0.30/0.012 0.30/0.012 0.30/0.012
V ≥27 ga. 25-20µ -500 635 0.25/0.010 0.20/0.008 0.15/0.006
VI ≥32ga. 15-5µ NA 0.10/0.004 0.10/0.004 0.05/0.002
Flux Features
Dispensing NC RA RMA WS
Clear Residue Yes No No No
Difficult-to-Solder Surfaces Yes No Yes Yes
Enhanced Wetting Yes Yes Yes Yes
Extended Reflow Cycle Time (> 6 minutes) Yes No Yes No
Fine Pitch Yes Yes Yes Yes
Gap Filling and/or Vertical Surfaces Yes No Yes No
General Purpose Yes Yes Yes Yes
Halide-free No No No Yes
Lead-free Shiny Fillet Yes No No No
Low Residue Yes No No No
Pin Transfer or Dipping (low viscosity) Yes No No No
Rapid Reflow Cycle Time (< 5 seconds) No No Yes No
Reduced Slump Yes No Yes Yes
Restricted Residue Yes No No No
UV Traceable No No Yes No
Printing NC RA RMA WS
24-hour Yes No Yes Yes
Clear Residue Yes No No No
Difficult-to-Solder Surfaces No Yes Yes No
Enhanced Wetting Yes No Yes Yes
Extended Reflow Cycle Time (>6 minutes) Yes No Yes Yes
Fine Pitch Yes Yes Yes Yes
General Purpose Yes Yes Yes Yes
Halide-free No No No Yes
Lead-free Shiny Fillet Yes No No No
Reduced Slump Yes No Yes Yes
Restricted Residue Yes No No No


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