The stud pull test methodology involves the bonding of a back plate to the device which acts as a mechanical stop when applying the load which is applied using a disposable stud which has been glued to the die using a cynoacrelate.
The sample is then placed into a fixture (if testing horizontally) and the load is applied using a shear cartridge. When testing in Z a stud is simply glued to the die and the load is applied by a pull cartridge.