Stud Pull

Nordson DAGE bondtesters provide stud pull tests (up to 200kg) for the removal of die from packages or leadframes and cater for both horizontal and vertical stud pull methods. Tests are performed in accordance with the guidelines as defined in MIL STD 883.

The stud pull test methodology involves the bonding of a back plate to the device which acts as a mechanical stop when applying the load which is applied using a disposable stud which has been glued to the die using a cynoacrelate.

The sample is then placed into a fixture (if testing horizontally) and the load is applied using a shear cartridge.  When testing in Z a stud is simply glued to the die and the load is applied by a pull cartridge.