Overhanging Die

Nordson DAGE bondtesters provide a solution for the testing of overhanging die (up to 250kg), used to test interconnections within stack die commonly found in system-in-package devices.

Testing overhanging die surfaces presents various challenges.  Performing ball bond shear testing can be difficult due to the thin spacing between die and low profile wire bonding and the possible deflection of the surface during load tool landing and setting the required step back.

Step back is defined as the distance between the tip of the load tool and the surface adjacent to the bond.  The complication of the possible deflection of the die surface during load tool landing and setting the required step back is overcome by the use of an oscillating load tool in combination with advanced software which controls the sequence of operations during bond testing.