Hot Bump Pull/Hot Pin Pull

Nordson DAGE has developed a unique patented technique for attaching a test probe to solder bumps or solder paste in order to perform a hot bump pull test in full accordance with the recently published IPC-9708 test standards for the detection of pad cratering for surface mount and printed circuit board assemblies.

Pad cratering has become a major issue with lead-free assemblies and the development of the IPC-9708 standard together with the availability of the4000Plus hot bump pull test methodology enables product developers to determine the optimum materials for their applications.

The 4000Plus hot bump pull application is achieved by selecting a specialized load cartridge which can be programmed to apply a time-temperature reflow profile to individual solder bumps and/or bonds using a test probe.  Reflow parameters including pre-heating, soak, rate of rise, time above liquidous as well as cooling rate are integrated into the 4000Plus Paragon™ software for easy on-screen profiling and control.  A selection of standard probe sizes are offered as well as custom test tips which are available upon request.

View Video - Reflow and test of 300µm solder ball

View Video - Pull test of 500µm pad

View Hot Bump Pull Application Note