The hot bump pull test method is used by many substrate manufacturers in order to remove the maximum amount of material possible from a bonding pad to expose the land area and is applicable to both traditional solder ball and flip chip bumps either bonded or formed by the deposition process.
The hot bump pull process involves the reflowing of a probe into the ball/bump, cooling, then applying a vertical pull load until the joint fails in accordance with the standard JEITA EIAJ ET-7407.
Hot bump pull is also used to identify pad crater failures on the substrate side.