First Bond Ball Pull/ Stud Bump Pull

Nordson DAGE bondtesters cater for the requirements of first bond ball pull and stud bump pull testing.

First bond ball pull
First bond ball pull testing (up to 100grams) is predominantly used as an alternative to ball shear testing to verify copper wire ball bonds which is increasingly being as an alternative to gold for semiconductor interconnects.  First bond ball pull utilises cold bump pull jaw technology to apply a vertical load (a pull test) to ball bonds and stud bumps.  Ball shear tests can sometimes promote pad cratering due to the aggressive nature of the bonding process which can weaken the ball bonds.

Stud bump pull
Stud bump pull testing (up to 100grams) is applicable where wire bonded stud bumps are used as an alternative to traditional flip chip bumps where shear testing would be applied.  Testing the mechanical integrity of these stud bumps is an important part of manufacturing quality control both for wafers and on diced die.