Cold Bump Pull

Nordson DAGE bondtesters provide cold bump pull tests (up to 10kg) for use in the production test environment to vertically remove the solder ball from a device or substrate by using patented tweezer jaws. Tests are performed in accordance to JEDEC JESD22-B115 and JEITA EIAJ ET-7407.

The cold bump pull jaws have a cavity etched into it to match as closely as possible to the diameter of the solder ball being tested.  The jaws grip the solder ball without damaging the bonding area and applies a load that is virtually symmetrical to the area of attach, therefore applies a more uniform stress field to the ball.

The cold bump pull test method is required as traditional shear testing tends to deform the solder ball during the test such that the area of attach can become damaged during the process. Also border line failures can under some circumstances gain support from the side wall of a cavity and traditional shear testing may miss this.