PCB Assembly

Ball Grid Array (BGA) and Chip Scale Packages (CSP) are widely used in a vast range of electronic products. Nordson DAGE nano-focus X-ray systems offer ultra high resolution inspection for the PCB assembly market including the 2D inspection of the newer Package on Package (PoP) devices alllowing non-destructive examination of the quality of the solder joints within the POP device.

The Nordson DAGE XD7500NT950 X-ray system is the perfect machine for the whole range of PCBA inspection tasks with an easy to use graphical user interface, accurate automated routines and ultra crisp images. It fulfils all tasks with ease and can be used by semi-skilled operators.