LEDs present many advantages over incandescent light sources including lower energy consumption, longer lifetime and flexibility.
Modern LEDs are extremely bright therefore generate heat which results in temperature increasingly becoming an issue. Heat stresses the die attach as well as the wire bond which causes displacement in the bulk of moulding compound. Thermal and mechanical stress weakens the wire bond, eventually breaking it off. With this in mind the manufacturing process needs to be carefully monitored and optimized to guarantee a long life time of the product.
The Nordson DAGE bondtesters provide market leading capability to cater for the challenging test applications presented by light emitting diodes (LEDs) including; wire pull, ball shear, die shear of standard and low profile dies, tweezer and wafer level tests.
Nordson DAGE X-ray systems are ideal for the inspection of these components. The super quick and high contrast live image together with the large tray size allow large quantities of LED's to be inspected quickly and accurately.