Hybrid & Substrate Microcircuits

Applications for hybrid microcircuits are wide ranging yet particularly well suited for use in military and communications, as well as within custom microelectronic designs. It is an area which has evolved greatly in recent years with the development of multichip modules and packages. The testing of hybrid microcircuits needs to cater for the complexity presented by the different types of discrete components and integrated circuits which are mounted on to the substrate.

Nordson DAGE bondtesters are well suited for the specialised techniques required for the testing of hybrid and substrate microcircuits. The range of bondtesters which include automated solutions, ensures accurate, reliable and efficient testing.

Both Nordson DAGE's 2D X-ray systems and their CT capability are ideal for this market. Allowing very small features to be easily inspected and complex devices like Package on Package (PoP) to be accurately modelled and investigated.

Featured Products


XD7500NT950HP X-ray System

Featuring the all new XiDAT 3 detector and the award winning 3rd generation micro-focus Nordson DAGE NT tube. The system also benefits from passive vibration isolation, easy to use point and click software, 70 degree oblique views for 360 degrees around any point in the entire inspection area. Its 10 watts of power are well able to cope with demanding applications including metal cored boards and copper backed BGA's. These unique features make the system ideally placed for PCB applications.



4000 MultipurposeTester

The industry standard 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The system can be configured as a simple wire pull tester and upgraded to provide ball shear, die shear, bump pull, vectored-pull, or tweezer pull tests.