Applications for hybrid microcircuits are wide ranging yet particularly well suited for use in military and communications, as well as within custom microelectronic designs. It is an area which has evolved greatly in recent years with the development of multichip modules and packages. The testing of hybrid microcircuits needs to cater for the complexity presented by the different types of discrete components and integrated circuits which are mounted on to the substrate.
Nordson DAGE bondtesters are well suited for the specialised techniques required for the testing of hybrid and substrate microcircuits. The range of bondtesters which include automated solutions, ensures accurate, reliable and efficient testing.
Both Nordson DAGE's 2D X-ray systems and their CT capability are ideal for this market. Allowing very small features to be easily inspected and complex devices like Package on Package (PoP) to be accurately modelled and investigated.