Microelectronics play a vital role in automotive design and manufacture to deliver the high level of functionality and built-in intelligence that today’s consumers expect from a vehicle. Hybrid microcircuit technology and MEM’s devices are utilized in environmentally protected modules throughout a vehicle, the majority of which are quite substantial in size.
Nordson DAGE bondtesters address these specific requirements by providing an increased working envelope to cater for the module size, as well as having the ability to gain access deep into the module in order to conduct the test.
Nordson DAGE X-ray systems provide capability which allows for a wide range of inspection tasks from faults at a component level to the non-destructive testing of potted assemblies.