Automotive

Microelectronics play a vital role in automotive design and manufacture to deliver the high level of functionality and built-in intelligence that today’s consumers expect from a vehicle. Hybrid microcircuit technology and MEM’s devices are utilized in environmentally protected modules throughout a vehicle, the majority of which are quite substantial in size.

Nordson DAGE bondtesters address these specific requirements by providing an increased working envelope to cater for the module size, as well as having the ability to gain access deep into the module in order to conduct the test.

Nordson DAGE X-ray systems provide capability which allows for a wide range of inspection tasks from faults at a component level to the non-destructive testing of potted assemblies.

Featured Products

 

XD7600NT100HP X-ray System

Nordson DAGE's Flagship system. Featuring the all new XiDAT 3 detector and the award winning 3rd generation nano-focus Nordson DAGE NT tube. The system also benefits from active X-ray image stabilisation, easy to use point and click software and 70 degree oblique angle views for 360 degrees around any point in the entire inspection area.

 

 
4000 MultipurposeTester

The industry standard 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The system can be configured as a simple wire pull tester and upgraded to provide ball shear, die shear, bump pull, vectored-pull, or tweezer pull tests.