Hybrid microcircuit technology is utilized throughout an aircraft to deliver the complex high performance functions that are required across a wide range of areas.
Nordson DAGE bondtesters provide the accuracy that is essential for both destructive and 100% non-destructive test evaluation to be performed in a repeatable manner, for both the development of new aerospace microelectronics and in the production line.
The XD7500NT950HP is the ideal Nordson DAGE X-ray machine for this market. Easy to use providing high quality images with sub-micron resolution, its 10 watts of power are well able to cope with demanding applications including metal cored boards and copper backed Ball Grid Arrays (BGAs).