Aerospace

Hybrid microcircuit technology is utilized throughout an aircraft to deliver the complex high performance functions that are required across a wide range of areas.

Nordson DAGE bondtesters provide the accuracy that is essential for both destructive and 100% non-destructive test evaluation to be performed in a repeatable manner, for both the development of new aerospace microelectronics and in the production line.

The XD7500NT950HP is the ideal Nordson DAGE X-ray machine for this market. Easy to use providing high quality images with sub-micron resolution, its 10 watts of power are well able to cope with demanding applications including metal cored boards and copper backed Ball Grid Arrays (BGAs).

Featured Products

XD7500NT950HP X-ray System

Featuring the all new XiDAT 3 detector and the award winning 3rd generation micro-focus Nordson DAGE NT tube. The system also benefits from passive vibration isolation, easy to use point and click software, 70 degree oblique views for 360 degrees around any point in the entire inspection area. Its 10 watts of power are well able to cope with demanding applications including metal cored boards and copper backed BGA's. These unique features make the system ideally placed for PCB applications.

 

 
4000 MultipurposeTester

The industry standard 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The system can be configured as a simple wire pull tester and upgraded to provide ball shear, die shear, bump pull, vectored-pull, or tweezer pull tests.