X-Ray Inspection Systems and Bond Test Equipment

Nordson DAGE was founded in 1961 and is a market leading provider of award winning bond test and x-ray inspection systems for destructive and non-destructive mechanical testing and inspection of electronic components.

Nordson DAGE has developed a wide range of capabilities and solutions to cater for the testing requirements from across a broad spectrum of industries.

Bondtesters

Nordson DAGE is the leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.

Micro Materials Testing

With over 30 years' experience in small geometry testing, Nordson DAGE is a pioneer in micro materials testing offering unrivalled expertise and capability across a range of materials and applications.

Wafer X-ray Metrology

The Nordson DAGE XM8000 offers fast automatic X-ray measurement of TSVs, 3D packages, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions

X-ray Systems

Nordson DAGE's award winning X-ray inspection systems have been specifically and ergonomically designed for the circuit board (PCB) and semiconductor industries offering high resolution nano-focus X-ray systems for both failure analysis labs and the production environment.

Bondtesters

Nordson DAGE is the leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond testing technology.

Recognized as the industry standard Nordson DAGE has a truly global presence and takes pride in delivering support to both local and international organizations alike.

NEW Wafer Testing Solutions Brochure

View our New Materials Testing Video

4000Plus Bondtester

Paragon Software

4000 Multipurpose

4000HS High Speed 

4000W Wafer Handling  

4300 Series

4500 Series

Vision Systems

X-ray Systems and Platforms

NEW X-RAY WAFER METROLOGY PLATFORM -
The Nordson DAGE XM8000

Nordson DAGE's award winning X-ray systems have been specifically and ergonomically designed for Printed Circuit Board assembly (PCB) and semiconductor industries   not only within failure analysis laboratories but also within the production environment

Aerospace & Military
XD7600NT Diamond FP
XD7600NT Diamond
XD7600NT Ruby FP
XD7600NT Ruby
XD7800NT Ruby XL for larger boards

Computer Tomography
CT option

Failure Analysis and Laboratory work
XD7600NT Diamond FP
XD7600NT Diamond

PCB Assembly
XD7600NT Ruby FP
XD7600NT Ruby
XD7800NT Ruby XL for larger boards
XD7500VR Jade FP

Semiconductor and high technology applications
XD7600NT Diamond FP
XD7600NT Diamond
XD7800NT Ruby XL for larger boards

 

XD Series Comparison Chart

 

Latest News

Nordson DAGE Accepts a 2014 NPI Award for Camera Assist Automatic Bondtesting at APEX
Advanced technology guarantees accuracy and repeatability

NEW X-ray Technical Paper
Recent advances in the X-ray inspection technology with emphasis on large board Computer Tomography and
Automation

Nordson DAGE Launches the XM8000 Wafer X-ray Metrology Platform -
Unprecedented levels of precision, detection and throughput for fully automated  wafer measurement of TSV’s, 3D packages and wafer bumps

Global SMT & Packaging Presents Nordson DAGE with Editor’s Choice Award for 4000 Optima Bondtester

Nordson DAGE wins 2nd Global SMT Award for the Jade FP X-ray Inspection System

 

 

Events

NEPCON CHINA 2014
(23 Apr 2014-25 Apr 2014)
Visit Nordson DAGE and Nordson YESTECH - Booth No. B-1F25

SMT Hybrid Packaging
(06 May 2014-08 May 2014)
Nordson DAGE X-ray and Bondtest systems will be on display in the 3D-MID Booth in Hall 7 - 601/603 and in Hall 6- Booth 213.

CONTROL 2014, Stuttgart, Germany
(06 May 2014-09 May 2014)
Nordson DAGE will exhibit their Materials Testing capabilities at Control Hall 1 -Stand No. 1724

IMAPS New England. Massachusetts
(06 May 2014-06 May 2014)
Our Representative EMA Sales & Marketing will be exhibiting the Nordson DAGE 4000Plus with camera assist fully automatic pull test in booth #505

ECTC 2014
(28 May 2014-29 May 2014)
Nordson DAGE Bond Test will be exhibiting at ECTC, Booth #317, Walt Disney World Swan and Dolphin Resort Northern Hemispheres Ballroom, Florida

SEMICON WEST 2014
(08 Jul 2014-10 Jul 2014)
Visit Nordson DAGE and Nordson YESTECH Test and Inspection in Booth #5744 Learn more about the new Nordson DAGE XM8000 Wafer Metrology Platform in Booth #1413