X-Ray Inspection Systems and Bond Test Equipment

Nordson DAGE was founded in 1961 and is a market leading provider of award winning bond test and x-ray inspection systems for destructive and non-destructive mechanical testing and inspection of electronic components.

Nordson DAGE has developed a wide range of capabilities and solutions to cater for the testing requirements from across a broad spectrum of industries.

Bondtesters

Nordson DAGE is the leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.

Micro Materials Testing

With over 30 years' experience in small geometry testing, Nordson DAGE is a pioneer in micro materials testing offering unrivalled expertise and capability across a range of materials and applications.

Wafer X-ray Metrology

The Nordson DAGE XM8000 offers fast automatic X-ray measurement of TSVs, 3D packages, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions

X-ray Systems

Nordson DAGE's award winning X-ray inspection systems have been specifically and ergonomically designed for the circuit board (PCB) and semiconductor industries offering high resolution nano-focus X-ray systems for both failure analysis labs and the production environment.

Bondtesters

Nordson DAGE is the leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond testing technology.

Recognized as the industry standard Nordson DAGE has a truly global presence and takes pride in delivering support to both local and international organizations alike.

NEW Wafer Testing Solutions Brochure

View our New Materials Testing Video

4000Plus Bondtester

Paragon Software

4000 Multipurpose

4000HS High Speed 

4000W Wafer Handling  

4300 Series

4500 Series

Vision Systems

X-ray Systems and Platforms

NEW Xi3400 - Automated X-ray Inspection System

 

NEW SOFTWARE UPGRADES NOW AVAILABLE -

Upgrade to Windows 7

Upgrade to Windows 7 plus X-Plane


NEW X-RAY WAFER METROLOGY PLATFORM -
The Nordson DAGE XM8000

Nordson DAGE's award winning X-ray systems have been specifically and ergonomically designed for Printed Circuit Board assembly (PCB) and semiconductor industries   not only within failure analysis laboratories but also within the production environment

Aerospace & Military
XD7600NT Diamond FP
XD7600NT Diamond
XD7600NT Ruby FP
XD7600NT Ruby
XD7800NT Ruby XL for larger boards

Computer Tomography
CT option

Failure Analysis and Laboratory work
XD7600NT Diamond FP
XD7600NT Diamond

PCB Assembly
XD7600NT Ruby FP
XD7600NT Ruby
XD7800NT Ruby XL for larger boards
XD7500VR Jade FP

Semiconductor and high technology applications
XD7600NT Diamond FP
XD7600NT Diamond
XD7800NT Ruby XL for larger boards

 

XD Series Comparison Chart

 

Latest News

Nordson Advanced Technology K.K. Japan Moves to Larger, Customer-Focused Facility
Supports Nordson ASYMTEK, Nordson DAGE, Nordson MARCH, Nordson YESTECH for applications in semiconductor packaging and electronics assembly

Nordson DAGE Announces Further Orders for its Unique Patented Hot Pin Pull Test Method on the 4000Plus Bondtester -
The only system that fully complies with IPC-9708 test standards

Nordson DAGE Announces Latest Order for XM8000 and Attendance at IWLPC -
The Fastest  Fully Automatic X-ray Metrology tool for Wafer Bumps and TSV’s

Peter Koch of Nordson DAGE Will Discuss Failure Analysis with X-ray at Etek’s Technology Event

Nordson DAGE Awarded a Global Technology Award for Camera Assist Automatic Bondtesting at SMTA International - 2nd Award for this core application

View our latest Technical Paper - X-ray / Bondtester Reliability Study of BGA Devices – Impact of Interfacial Voiding - Presented at SMTAI September 2014

Nordson DAGE Announces the launch of its new Xi3400 Automated X-ray Inspection System

Dr. Evstatin Krastev from Nordson DAGE to Present Two Ground-breaking X-ray Inspection Studies during the Technical Sessions at SMTAI 2014


Nordson DAGE Receives Recognition from the Asian Electronics Industry -
Dual Awards for the Company

2014 SMT China Vision Award in the category – Functional Test

2014 EM Asia Innovation Award in the category - Test Instruments

Nordson DAGE Accepts a 2014 NPI Award for Camera Assist Automatic Bondtesting at APEX
Advanced technology guarantees accuracy and repeatability

NEW X-ray Technical Paper
Recent advances in the X-ray inspection technology with emphasis on large board Computer Tomography and
Automation

 

 

Events

Semicon Japan
(03 Dec 2014-05 Dec 2014)
Hall 1 Booth No 1069

3D Architectures for Semiconductor Integration and Packaging
(10 Dec 2014-12 Dec 2014)
Learn more about the Nordson DAGE XM8000 Wafer X-ray Metrology system at 3D ASIP

Nepcon Japan 2015
(14 Jan 2015-16 Jan 2015)
Hall 3 - Booth No : East 26 – 3

European 3D TSV Summit 2015
(19 Jan 2015-21 Jan 2015)
Learn more about the Nordson DAGE XM8000 Wafer X-ray Metrology system - Booth No. 6

Semicon Korea 2015
(04 Feb 2015-06 Feb 2015)

APEX 2015
(24 Feb 2015-26 Feb 2015)
Visit Nordson DAGE and Nordson YESTECH in Booth Nos. 1101/1201