X-Ray Inspection Systems and Bond Test Equipment

Nordson DAGE was founded in 1961 and is a market leading provider of award winning bond test and x-ray inspection systems for destructive and non-destructive mechanical testing and inspection of electronic components.

Nordson DAGE has developed a wide range of capabilities and solutions to cater for the testing requirements from across a broad spectrum of industries.


Nordson DAGE is the leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.

Micro Materials Testing

With over 30 years' experience in small geometry testing, Nordson DAGE is a pioneer in micro materials testing offering unrivalled expertise and capability across a range of materials and applications.

Wafer X-ray Metrology

The Nordson DAGE XM8000 offers fast automatic X-ray measurement of TSVs, 3D packages, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions

X-ray Systems

Nordson DAGE's award winning X-ray inspection systems have been specifically and ergonomically designed for the circuit board (PCB) and semiconductor industries offering high resolution nano-focus X-ray systems for both failure analysis labs and the production environment.


Nordson DAGE is the leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond testing technology.

Recognized as the industry standard Nordson DAGE has a truly global presence and takes pride in delivering support to both local and international organizations alike.

NEW Wafer Testing Solutions Brochure

View our New Materials Testing Video

4000Plus Bondtester

Paragon Software

4000 Multipurpose

4000HS High Speed 

4000W Wafer Handling  

4300 Series

4500 Series

Vision Systems

X-ray Systems and Platforms

Latest News

Dual Win for Nordson DAGE Camera Assist Automatic Bondtesting at Nepcon China 2015 - Fourth award for this application

Nordson DAGE's Peter Koch to present "Evaluation of cracks in welded components using Tomosynthesis and micro-CT techniques" at the IPC Trouble Shooting Workshop in Genova 28th May

Nordson’s Hal Hendrickson Appointed to the IPC APEX Exhibitor Committee

Nordson DAGE Announces the Introduction of a New Method for Testing Thin Die in Accordance to the SEMI Standard G96-1014 -
Additional capability for Micro Materials Test applications on the 4000Plus platform

Nordson DAGE X-ray Systems Announces X-ray European Distributor of the Year

Nordson Advanced Technology K.K. Japan Moves to Larger, Customer-Focused Facility
Supports Nordson ASYMTEK, Nordson DAGE, Nordson MARCH, Nordson YESTECH for applications in semiconductor packaging and electronics assembly

Nordson DAGE Announces Further Orders for its Unique Patented Hot Pin Pull Test Method on the 4000Plus Bondtester -
The only system that fully complies with IPC-9708 test standards

Nordson DAGE Announces Latest Order for XM8000 and Attendance at IWLPC -
The Fastest  Fully Automatic X-ray Metrology tool for Wafer Bumps and TSV’s

Peter Koch of Nordson DAGE Will Discuss Failure Analysis with X-ray at Etek’s Technology Event

Nordson DAGE Awarded a Global Technology Award for Camera Assist Automatic Bondtesting at SMTA International - 2nd Award for this core application

View our latest Technical Paper - X-ray / Bondtester Reliability Study of BGA Devices – Impact of Interfacial Voiding - Presented at SMTAI September 2014

Nordson DAGE Announces the launch of its new Xi3400 Automated X-ray Inspection System

Dr. Evstatin Krastev from Nordson DAGE to Present Two Ground-breaking X-ray Inspection Studies during the Technical Sessions at SMTAI 2014

Nordson DAGE Receives Recognition from the Asian Electronics Industry -
Dual Awards for the Company

2014 SMT China Vision Award in the category – Functional Test

2014 EM Asia Innovation Award in the category - Test Instruments

Nordson DAGE Accepts a 2014 NPI Award for Camera Assist Automatic Bondtesting at APEX
Advanced technology guarantees accuracy and repeatability

NEW X-ray Technical Paper
Recent advances in the X-ray inspection technology with emphasis on large board Computer Tomography and




Nepcon South China 2015
(25 Aug 2015-27 Aug 2015)
Visit Nordson DAGE in Booth No. A-1H20

Semicon Taiwan 2015
(02 Sep 2015-04 Sep 2015)
Nordson DAGE will be exhibiting with their distributor CohPros - Booth No. 2400

SMTAI 2015 Chicago
(29 Sep 2015-01 Oct 2015)
Visit Nordson DAGE and Nordson YESTECH in Booth No. 606

Productronica 2015
(10 Nov 2015-13 Nov 2015)
Visit Nordson DAGE and Nordson YESTECH - Stand No. A2 - 361