The latest news from Nordson DAGE


Nordson DAGE’s Peter Koch to Discuss Failure Analysis with X-ray at EPP’s Innovations Forum
(03 Mar 2015)

Nordson’s Hal Hendrickson Appointed to the IPC APEX Exhibitor Committee
(12 Feb 2015)

Nordson DAGE Announces the Introduction of a New Method for Testing Thin Die in Accordance to the SEMI Standard G96-1014
(10 Dec 2014)
Additional capability for Micro Materials Test applications on the 4000Plus platform

Nordson DAGE X-ray Systems Announces European Distributor of the Year 2014
(28 Nov 2014)

Nordson Advanced Technology K.K. Japan Moves to Larger, Customer-Focused Facility
(26 Nov 2014)
Supports Nordson ASYMTEK, Nordson DAGE, Nordson MARCH, Nordson YESTECH for applications in semiconductor packaging and electronics assembly

Nordson DAGE Announces Further Orders for its Unique Patented Hot Pin Pull Test Method on the 4000Plus Bondtester
(17 Nov 2014)

Nordson DAGE Announces Latest Order for XM8000 and Attendance at IWLPC
(04 Nov 2014)
The Fastest Fully Automatic X-ray Metrology tool for Wafer Bumps and TSV’s

Peter Koch of Nordson DAGE Will Discuss Failure Analysis with X-ray at Etek’s Technology Event
(03 Nov 2014)

Nordson DAGE Awarded a Global Technology Award for Camera Assist Automatic Bondtesting at SMTA International
(22 Oct 2014)
2nd Award for this Core Application

Nordson DAGE Launches the Xi3400 Automated X-ray Inspection System
(05 Sep 2014)

Nordson DAGE Appoints Richard Frisk as European Sales Manager for Inspection Products
(01 Sep 2014)

Mr. Louis Lin from Nordson DAGE to Present at IPC Southeast Asia High Reliability Conference
(19 Aug 2014)
Get practical methodologies that can be deployed today to enhance your operations

Dr. Evstatin Krastev from Nordson DAGE to Present Two Ground-breaking X-ray Inspection Studies during the Technical Sessions at SMTAI 2014
(05 Aug 2014)

Nordson DAGE Receives Recognition from the Asian Electronics Industry for the 4000 Optima Bondtester
(19 May 2014)
Nordson DAGE Receives Recognition from the Asian Electronics Industry for the 4000 Optima Bondtester 2014 SMT China Vision Award in the category – Functional Test 2014 EM Asia Innovation Award in the category - Test Instruments

Nordson DAGE Accepts a 2014 NPI Award for Camera Assist Automatic Bondtesting at APEX
(14 Apr 2014)

Nordson DAGE Expands into New Research and Development Facility
(25 Feb 2014)

Nordson DAGE Launches the XM8000 Wafer X-ray Metrology Platform
(17 Jan 2014)
Unprecedented levels of precision, detection and throughput for fully automated wafer measurement of TSV’s, 3D packages and wafer bumps

Nordson DAGE Continues Its ‘Performance Beyond Expectations’ with a 2013 Global Technology Award
(21 Nov 2013)
Second Award Presented to Nordson DAGE at Productronica 2013

Global SMT & Packaging Presents Nordson DAGE with Editor’s Choice Award for 4000 Optima Bondtester
(20 Nov 2013)
Presented to Nordson DAGE at Productronica 2013

Nordson DAGE Brings ‘Performance Beyond Expectations’ to Productronica 2013
(08 Nov 2013)
Nordson DAGE will be showcasing its new 2nd Generation 4000Plus Bondtester on Stand A2:438 together with its award winning X-ray Inspection systems

Quick Links


(05 May 2015-08 May 2015)
Nordson DAGE with be exhibiting their Micro Materials Test and Inspection equipment in Hall 1 - Stand 1724

SMT Hybrid Packaging 2015
(05 May 2015-07 May 2015)
Visit Nordson DAGE and Nordson YESTECH in Hall 7A - Stand 131

ECTC 2015
(28 May 2015-31 May 2015)
Nordson DAGE Bond Test will exhibit at this event in Booth #212

Electronics and Automation-Electronics
(02 Jun 2015-04 Jun 2015)
With our X-ray Distributor Partnertec

AB Electronics Technology Days
(17 Jun 2015-18 Jun 2015)
Nordson DAGE distributor AB Electronic Devices will be holding a Technology event in Barcelona. For further details please contact

Semicon West 2015
(14 Jul 2015-16 Jul 2015)

Nepcon South China 2015
(25 Aug 2015-27 Aug 2015)