Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it will participate in the Package-on-Package (PoP) Design and Assembly Center during the annual SMTA International conference, scheduled to take place October 14-18, 2012 in Orlando, Florida.
The Nordson DAGE XD7600NT Diamond FP X-ray Inspection System with the revolutionary new X-Plane™ option will be demonstrated as part of the PoP center. The XD7600NT is the ultimate choice for the highest magnification X-ray imaging. The unique Nordson DAGE NT maintenance-free, sealed transmissive X-ray tube, providing 0.1 µm feature recognition and up to 10 W of power, together with the 3 Mpixel long life digital Flat Panel detector makes this system the choice for the highest performance and highest magnification imaging tasks. The vertical system configuration, with the X-ray tube sitting below the isocentric ‘move and tilt’ of the detector, all controlled through the simple, joystick-free, ‘point and click’ operation of the Nordson DAGE Image Wizard Software provides the safe and collision-free inspection required for production applications.
The hands-on PoP Center will be located right on the exhibition show floor on Tuesday and Wednesday during the electronics exhibition. Attendees can see the process first-hand, including placement of PoP, in-process inspection of package assemblies, application of dip paste and dip flux, rework of PoP and inspection, and PoP process defects, causes and cures. Attendees are encouraged to bring samples and technical challenges to examine at the event. For more information, visit http://www.smta.org/smtai/pop.cfm.