Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will introduce X-Plane™ to the U.S. market for the first time in Booth #3208 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.
This revolutionary option for Nordson DAGE’s range of industry-leading X-ray inspection systems uses a proprietary, patent applied for, tomosynthesis, or CT technique to create 2D X-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board. In this way, the superior image quality that Nordson DAGE X-ray systems always provides can now be extended into separating individual layers at a level of excellence that the traditional laminography technique cannot achieve.
X-Plane™ technology is quick, simple and easy-to-use. The board is placed in the Nordson DAGE X-ray inspection system and X-ray images are taken 360° around the region of interest. X-Plane™ shows the position and size of voids at joint interfaces and other locations within BGA, CSP, QFN, LGA, etc. Additionally, the technology can identify Head-on-Pillow (HoP) and open joints.
Also on display, the Nordson DAGE XD7600NT Diamond FP and XD7600NT Ruby FP are the ultimate flat panel inspection systems with QuickView CT. The inspection systems utilize the latest technology, flat panel detector and proven feature recognition capability to provide the ultimate choice for the highest quality in X-ray imaging on the market today.