Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) is pleased to announce that its latest bond testing and X-ray inspection systems will be exhibited in Booth 5971 at the Semicon West exhibition scheduled to take place on 12 - 14th July 2011 in San Francisco, California.
Nordson DAGE will showcase its complete line of bond testing technology, including the revolutionary 4000Plus bondtester representing the new industry standard in bond testing with unsurpassed data accuracy and repeatability. Also on display will be the 4000HS high-strain rate and 4000 multi-purpose bondtesters. Nordson DAGE bond test technology meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. Both the 4000 and 4000Plus bondtesters use the next generation Paragon™ software providing semi-automatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting.
Also on display is the Nordson DAGE XD7600NT Diamond X-ray inspection system utilizing the latest technology, flat panel detector and proven feature recognition capability to provide the ultimate choice for the highest quality in X-ray imaging on the market today. Equipped with the unique Nordson DAGE NT maintenance-free, sealed transmissive X-ray tube, providing 100 nanometer (0.1µm) feature recognition and up to 10 watts of power, together with the 3 mega pixel long lifetime CMOS flat panel detector, the XD7600NT Diamond is the crystal clear choice for the greatest performance and highest magnification of real-time imaging. In addition, Nordson DAGE will show its µCT 3D modeling and volumetric measurement ideally suited for analytical investigation of critical applications such as stacked die, MEMS, PiP and PoP devices.
A high resolution picture of the XD7600NT Diamond can be downloaded here