Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that its latest bond testing and X-ray inspection systems will be exhibited in Booth 7-226 at the SMT/Hybrid/Packaging 2012 exhibition scheduled to take place May 8-10, 2012 at the Messezentrum Nuremberg, Germany.
Nordson DAGE will showcase its next generation 4000Plus bondtester which represents the new industry standard in bond testing with unsurpassed data accuracy and repeatability. The 4000Plus is suitable for the full spectrum of traditional bond tests as well as meeting the requirements of emerging test applications including ribbon pull, bend and fatigue testing and pad cratering using hot pin pull.
Nordson DAGE will also highlight the revolutionary X-Plane™ X-ray System option. This option uses a proprietary, patent applied for, tomosynthesis, or CT technique to create 2D X-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board. In this way, the superior image quality that Nordson DAGE X-ray systems always provides can now be extended into separating individual layers at a level of excellence that the traditional laminography technique cannot achieve.
X-Plane™ technology is quick, simple and easy-to-use. The board is placed in the Nordson DAGE X-ray inspection system and X-ray images are taken 360° around the region of interest. X-Plane™ shows the position and size of voids at joint interfaces and other locations within BGA, CSP, QFN, LGA, etc. Additionally, the technology can identify Head-on-Pillow (HoP) and open joints.
Also on display will be the Nordson DAGE XD7600NT Diamond FP and XD7600NT Ruby X-ray inspection systems which utilize the latest technology to provide the ultimate choice for the highest quality in X-ray imaging on the market today.