Nordson DAGE, a division of Nordson Corporation
(NASDAQ: NDSN) announces that its latest bond testing
and X-ray inspection
systems will be exhibited in Booth A2:339 at the Productronica exhibition scheduled to take place from 15-18 November, 2011 in Munich, Germany.
Nordson DAGE will showcase its bond testing technology, including the next generation4000Plus bondtester
that represents the new industry standard in bond testing with unsurpassed data accuracy and repeatability.
Alongside other specialized applications Nordson DAGE will showcase its newly developed 4000Plus pad cratering inspection system
. This unique patented technique for attaching a test probe to solder bumps or solder paste in order to perform a hot bump pull test
is in full accordance with the recently published IPC-9708 test standards for the detection of pad cratering for surface mount and printed circuit board assemblies. Pad cratering has become a major issue with lead-free assemblies and the development of the IPC-9708 standard together with the availability of the 4000Plus hot bump pull test methodology enables product developers to determine the optimum materials for their applications.
Nordson DAGE’s flagship X-ray inspection systems, the XD7600NT Diamond FP
and XD7600NT Ruby FP
use the latest technology, flat panel detector to provide the highest quality real time X-ray imaging. The unique Nordson DAGE NT maintenance-free, sealed transmissive X-ray tube, providing 100 nanometer (0.1µm) feature recognition and up to 10 watts of power, together with the 3 mega pixel longer lifetime CMOS flat panel detector makes these systems the crystal clear choice for the greatest performance and highest magnification of real-time imaging.